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Shuttle DH610

Shuttle DH610
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Shuttle DH610

Shuttle DH610

 

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DH610
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Description

Shuttle DH610


ROBUST 1.3-LITRE SLIMPC SUPPORTS INTEL CORE GEN. 12
PROCESSORS “ALDER LAKE-S” AND THREE UHD DISPLAYS
The Shuttle XPC slim Barebone DH610 with H610 chipset houses the performance of Intel's 12th generation Core desktop processors (codenamed Alder Lake-S) for socket
LGA1700 in a compact 1.3-litre format. The DH610 allows for three Ultra HD displays to be
operated at the same time via 1x HDMI and 2x DisplayPort. It also offers Dual Intel LAN
(one supports 2.5G speed), eight USB ports and two COM ports. The slim metal chassis
comes with a VESA mount included, provides versatile connectivity and reliable operation
in environments with ambient temperatures of up to 50 °C. This platform is targeted at
professional applications such as Digital Signage, POS, POI, gambling machines, office,
healthcare and industry.


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Product Details
DH610

Data sheet

Audio
Audio Realtek® ALC 897/662/888S High-Definition Audio
Two analog audio connectors (3.5 mm) on the front panel:
1) 2-channel line-out (head-phones)
2) microphone input
Digital multi-channel audio output: by HDMI and DisplayPort
Chassis
Slim PC with black chassis made of metal
Dimensions: 190 x 165 x 43 mm (LWH) = 1.35-litre
Weight: 1.3 kg net and 2.1 kg gross
Two holes for Kensington Locks and numerous
threaded holes (M3) on both sides of the chassis
Integrated graphics
The features of the integrated Intel UHD graphics function
depend on the processor type used.
The PC features three video outputs which support 1080p/60 and 2160p/60:
- 1x HDMI v2.0b
- 2x DisplayPort v1.4
Supports displays with 4K Ultra HD resolution at 3840 x 2160
DisplayPort and HDMI support multi-channel digital audio over the same cable.
Optional analog D-Sub/VGA video output
Supports three independent displays with the integrated graphics function
Power Adapter
External 120 W power adapter (fanless)
Input: 100~240 V AC, 50/60 Hz
Output: 19 V DC, 6.32 A, max. 120 W
DC Connector: 5.5/2.5 mm (outer/inner diameter)
Remark: The DC-input of the computer supports an external power source with 19V±5% or 12V±5%.
AC mains cable: 3 pins, ca. 1.7 m length, with C5/C6 coupler (called "Mickey Mouse" or "Clover-leaf") for the power adapter and CEE-7/7 plug with earth-contact (type E+F) for the power outlet
Memory support
2x SO-DIMM slot with 260 pins
Supports DDR4-3200/2933/2666/2400/2133 (PC4-25600/23466/21300/19200/17000) SDRAM at 1.2 V
Supports Dual Channel mode
Supports a maximum of 32 GB per DIMM,
maximum total size: 64 GB
Supports two unbuffered DIMM modules (no ECC or registered)
Front Panel connectors
Microphone input
Audio Line-out (headphones)
1x USB 3.2 Gen 1 Type A (blue)
1x USB 3.2 Gen 1 Type C
2x USB 2.0 Type A (black)
Power button
Power LED (blue)
HDD LED (yellow)
Back Panel connectors
1x HDMI 2.0b connector
2x DisplayPort 1.4 connector (DP)
Optional: 1x D-Sub VGA connector (Accessory PVG01 )
2x USB 3.2 Gen 1 Type A (blue)
2x USB 2.0 Type A (black)
2x RJ45 LAN Port (1G + 2.5G)
2x RS232 serial port, 9-pin D-Sub (5/12V, 1x RS422/RS485) [3]
1x DC-input connector for external power adapter (supports 19V±5%)
1x 4-pin connector (2.54 mm pitch) supports:
- external power on button
- Clear CMOS function
- +5V DC voltage for external components
2x perforation for optional Wireless LAN antennas
2x hole for Kensington Lock
Other onboard connectors
1x jumper for power-on-after-power-fail (hardware solution)
1x analog VGA graphics output CN6 (2x 10-pin, 1 mm pitch)
2x serial interface (COM) occupied by backpanel connectors
1x USB 2.0 (4-pin) for optional accessory WWN03 (LTE kit)
1x fan connector (4-pin) occupied by the cooling system
1x connector for CMOS battery (occupied)
Environmental Specifications
Operating temperature range: 0~50 °C
Relative humidity, non-condensing: 10~90 %
Processor support
Processor Socket LGA1700
Supports Intel Core i9 / i7 / i5 / i3, Pentium Gold and Celeron processors
Supports 12th generation Intel Core processors, codename "Alder Lake-S"
in "Intel 7" process technology (previously Intel 10 nm Enhanced SuperFin)
Supports processors with integrated graphics only
Maximum supported processor power consumption (TDP) = 65 W
Does not support the unlock-function of Intel K-Series processors.
The processor integrates PCI-Express, memory controller
and the graphics engine on the same die.
(Performance features depend on processor type)
Please refer to the support list for detailed processor support information at global.shuttle.com.
Processor cooling
Heat-pipe processor cooling with two 60 mm fans on the upper side of the chassis
Optional Accessories
- PVG01: optional D-Sub VGA video output
- WLN-M (802.11ac, Wifi 5) or WLN-M1 (802.11ax, Wifi 6): WLAN module in M.2-2230 format supports WLAN and Bluetooth with two external antennas.
- WWN03: LTE adapter kit with antennas, but without LTE card
- PS02: Stand for vertical operation
- CXP01: adapter cable for external power button
- PRM01: 2U rack mount front plate for two Shuttle XPC slim PCs
- DIR01: DIN-Rail mounting kit
BIOS
AMI BIOS, SPI Interface, 16 MB Flash-EEPROM
Supports Hardware Monitoring and watchdog functionality
Supports Firmware-TPM (fTPM) v2.0
Supports boot up from external USB flash memory
Supports Unified Extensible Firmware Interface (UEFI)
Supports power on after power failure
Mainboard / Chipset
Mainboard in a Shuttle form factor proprietary design for the XPC DH610
Chipset/Southbridge: Intel® H610
Passive chipset cooling with heat sink
The Northbridge is integrated in the processor.
Solid Capacitors for sensitive areas provide excellent heat resistance for enhanced system durability
SATA connectors
1x Serial-ATA III, 6 Gb/s (600 MB/s) bandwidth
With Serial-ATA power connector (onboard)
Certifications / Compliance
EMI: FCC, CE, BSMI, RCM, VCCI
Safety: ETL, CB, BSMI
Other: RoHS, Energy Star, ErP
Conformity
This device is classed as a technical information equipment (ITE) in class B and is intended for use in living room and office. The CE-mark approves the conformity by the EU directives:
(1) 2004/108/EC relating to electromagnetic compatibility (EMC),
(2) 2006/95/EC relating to Electrical Equipment designed for use within certain voltage limits (LVD),
(3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)
Operating system
This system comes without an operating system.
It is compatible with Windows 10/11 and Linux (64-bit)
Supplied Accessories
Multi-language user guide (EN, DE, FR, ES, JP, KR, SC, TC)
VESA mount for 75/100 mm standard (two metal brackets)
Four screws M3 x 5 mm (screws together VESA mount and PC)
Four screws M4 x 10 mm (to affix VESA mount on the PC)
Four screws M3 x 4 mm (to mount a 2.5" storage device into the bay)
Two screws M3 x 5 mm (silver colour, to mount two M.2 cards)
Driver DVD (Windows 64-bit)
Serial ATA cable for 2.5" drive including power cable
External 120 W power adapter with power cord
Protection cap for CPU socket (do not use if heatpipe or fan is mounted)
Heatsink compound
M.2-2280M SSD slot
The M.2 2280M slot provides the following interfaces:
- PCI-Express Gen. 3.0 X4, supports NVMe
- SATA v3.0 (max. 6 Gbps)
It supports M.2 cards with a width of 22 mm
and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
Supports M.2 SSDs with SATA or PCI-Express interface
M.2-2230E slot for WLAN cards
Interfaces: PCI-Express Gen. 2.0 X1 und USB 2.0
Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
Supports WLAN expansion cards (optional Shuttle accessory: WLN-M / WLN-M1)
Drive bay
1x 6.35 cm / 2.5" storage bay supports one hard disk or SSD drive with SATA connector
Device height: 12.5 mm (max.)
Dual LAN Controller
Dual network with two RJ45 ports with two status LEDs each
Used network chips:
1) Intel 225 supports 100 / 1.000 / 2.500 MBit/s data transfer rate
2) Intel 219V/LM supports 10 / 100 / 1.000 MBit/s data transfer rate
PCIe interface
Supports WAKE ON LAN (WOL)
Supports network boot by Preboot eXecution Environment (PXE)
Attachments
Shuttle DH610
Hoja de datos de PIB-DH610001 Shuttle DH610
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